| 摘要 |
PURPOSE:To reduce the size of a cooler for a semiconductor element without lowering the cooling effect by forming a cooling liquid passage in a cooling piece to which the semiconductor element is pressurized and having a conductive terminal at one end, and displacing the core wire of the passage to the opposite side to the conductor terminal side. CONSTITUTION:A conductive terminal 3 is provided at one end of the cooling piece 1 for cooling a pressure contact type semiconductor element 6, and a liquid passing pipe 4 for passing cooling liquid is provided in the cooling piece 4. The core wire 4a is displaced at a distance L in opposite direction to the conductor terminal 3 from the core wire 5a of the pressure contacting surface 5. Since the passage between the inlet side and the outlet side of the cooling liquid is displaced twice of the displacing distance L when the elements 6 are connected in parallel, the pipe 7 of the connection can be shortened, thereby largely reducing the size of the device. Further, the connecting wire can be simplified, thereby facilitating maintenance. |
