发明名称 LEAD STRUCTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To speed up the tempo of a line bonding operation by making the entire practical width of the tip part of an inner lead the same and as wide as possible. CONSTITUTION:The bonded parts 17a-17c of inner leads 14a-14c have a fixed interval x between each other along a tab side, and have practical surfaces ya-yc which are all equal at the bonded parts 17a-17c and increasingly enlarged. In this way, if the variable allowable width of a capillary or a wedge of an automatic bonder is increased in the direction of bonded wiring between the electrode 18 of a pellet 13 and bonded part of the inner lead, it is possible to speed up the tempo of a bonding operation.
申请公布号 JPS5674948(A) 申请公布日期 1981.06.20
申请号 JP19790150654 申请日期 1979.11.22
申请人 HITACHI LTD 发明人 KAWADA KENRIYOU
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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