| 摘要 |
PURPOSE:To prevent a package from being damaged and assure an operating security by fixing a semiconductor pacakage on a cutting die under the fixing effect of vacuum suction and cutting a lead frame. CONSTITUTION:A package 4 is fed to the left edge of a die 5 and a mechanism 14 shifts the package to a cutting position 5a. A switch 19 detects, causing the mechanism 14 to return. Then an electromagnetic valve 18 works, sucking/fixing the package on the upper surface of a cutting die 5 through a hole 16. Concurrently, a stripper 6 and a punch 7 move and the stripper 6 makes the base of a lead frame 2 contact the die 5, resulting in the cutting of a joined part 12 of the frame by the punch 6. At the same time, the switch 20 works, opening the electromagnetic valve 18 and starting the function of vacuum suction. The stopper 6 and the punch 7 resume operation and the mechanism 14 restarts, moving to the right and carrying an uncut package to the cutting position 5a. Under this constitution, it is possible to automatically fix a package without any impact inflicted on it and assure a saft operation. |
