发明名称 |
HEAT SINK AND COOLING SYSTEM FOR SEMICONDUCTOR MODULES |
摘要 |
An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat conductive bodies having an opening or openings extending from the module surface toward, but not reaching, the top of the hollow heat sink. Means are provided to direct air flow substantially perpendicular to the upper end of the body. The air flow will be from the top of the heat sink and out of the opening or openings to cool the heat sink and the module. The heat sink structure provides greater surface area and effects the breaking up of the boundary layer near the surface of the module for enhanced cooling. |
申请公布号 |
EP0029501(A3) |
申请公布日期 |
1981.06.17 |
申请号 |
EP19800106265 |
申请日期 |
1980.10.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LEAYCRAFT, EDGAR CRAWFORD;OKTAY, SEVGIN;OSTERGREN, CARL DAVID |
分类号 |
H05K7/20;H01L23/367;H01L23/467;(IPC1-7):01L23/46;01L23/36 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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