发明名称 FORMING METHOD OF SULFIDE THIN FILM
摘要 PURPOSE:To form the sulfide thin film of a uniform thickness used for electronics, by using the target for sputtering, which is obtained by sulfurizing the surface of the sintered material of the metal oxide system superior in sintering and workability, to perform sulfide sputtering. CONSTITUTION:In production of the sulfide target used to the sulfide thin film, which is used widely in the field of electronics of the electroluminescence element, the photo electromotive force element, the photoconductive element, the piezoelectric element, and so on, by sputtering, sintered material 1 of oxides of Zn, Cd, Pb, Ti, Zr, Fe, and so on is heated at a high temperature in the CS2 atmosphere with N2 gas as the carrier gas. Sulfide sintered material layer 2 of these oxide metals is formed on the surface of oxide sintered material 1. This obtained material is used as the target for sputtering for formation of a sulfide thin film. The mechanical strength is high, and electric discharge is stable, and the sputtering speed is high, and the uniform sulfide thin film is formed.
申请公布号 JPS5672171(A) 申请公布日期 1981.06.16
申请号 JP19790150405 申请日期 1979.11.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TOUDA TAKAO;FUJITA YOUSUKE;MATSUOKA TOMIZOU;NITSUTA KOUJI
分类号 C04B41/87;C23C14/06;C23C14/34 主分类号 C04B41/87
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