发明名称 Method and means for measuring moisture content of hermetic semiconductor devices
摘要 The moisture content of a hermetically sealed semiconductor device is a function of the dew point of the cavity atmosphere which is the temperature of maximum surface conductivity. A pattern of interdigitated thin film aluminum conductors is provided on an impurity free, non-porous silicon oxide insulative substrate. The surface conductivity of this structure rises as moisture condenses onto and between the conductors as the temperature is reduced at a slow controlled rate to the dew point temperature. The amplitude of the maximum surface conductivity is proportional to ionic impurity concentration.
申请公布号 US4272986(A) 申请公布日期 1981.06.16
申请号 US19790030498 申请日期 1979.04.16
申请人 HARRIS CORPORATION 发明人 LOWRY, ROBERT K.;MILLER, LARRY A.
分类号 G01N25/68;G01N27/04;(IPC1-7):01N27/18 主分类号 G01N25/68
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