| 摘要 |
A process for forming a circuit board having rigid and flexible areas which includes the steps of severing an area corresponding to the board area which is to be flexible, from a rigid layer material, leaving the severed rigid layer area in place coplanar and contiguous with the remainder of the rigid layer material, laminating a covering layer to one surface of said rigid material and said rigid layer area, laminating a flexible layer material to the other surface of the rigid material without lamination to the surface of the rigid layer area and, after said circuit board has been completed, severing said covering layer around said severed rigid layer area and removing said severed covering layer and said severed rigid layer area from said board. |
