| 摘要 |
Apparatus for bonding heat bondable materials through the application of pressure and heat employs a diaphragm pressed by fluid pressure against the materials. The diaphragm comprises a web having a flexible heating element which is bonded to its non-material pressing side and has a configuration corresponding to the desired seam configuration. The web carries heat dissipating means to conduct heat away from the diaphragm and the materials in the seam configuration and heat directing means to conduct heat from the element to the seam area. Preferably the heating element, heat directing means and heat conducting means are formed from metallic foil bonded to both sides of the web and having portions etched away to provide electrically insulating channels separating one from another.
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