| 摘要 |
PURPOSE:To incorporate a power transistor into a hybrid IC easily by a method wherein circuit forming elements except the power transistor are made up on a heat-resisting insulating substrate, the power transistor is fastened on a metallic plate, and the insulating substrate and the metallic plate are unified. CONSTITUTION:A hole 2 is made to a ceramic substrate 1, and a conductor 3, a resistor 4, a transistor 5 having little power consumption, etc. are mounted. A power transistor 7 is fastened to an end surface of a projecting section 6a of a metallic substrate 6, and the projecting section 6a is conformed to the hole 2 of the substrate. The substrates 1, 6 are unified with adhesives 10 having inferiror heat conductivity previously applied on the surface of the substrate 1. Connection 8 is conducted, and sealed 9 with resin, thus preventing disconnection and a short- circuit. According to this constitution, cost can be reduced and a device can be miniaturized because the power transistor can easily be incorporated into a hybrid IC. |
