| 摘要 |
PURPOSE:To prepare the titled resin composition having excellent heat resistance, electrical properties, and adhesivity, soluble in general-purpose solvents, compoundable easily to prepare a prepreg, and suitable for a raw material of a copper- clad laminate board, by mixing an N-(alkenylphenyl)maleimide derivative and polybutadienes. CONSTITUTION:(A) A compound selected from an N-(alkenylphenyl)maleimide derivative of formula [R1-R6 are H, halogen, 1-10C alkyl, or (substituted) phenyl; X is H, halogen, carboxyl, alkoxy, cyano, etc.; m1+m2+m3=5] and its polymer is mixed with (B) polybutadienes having double bonds, pref. at a weight ratio of 95/5-5/95. If necessary, the reaction product of the component (A) with a primary amine compound is used together with or as a substitute for the component (A). |
