| 摘要 |
A bonding system comprising a solder head; a tip unit for receiving wire to be soldered; a heater for heating the tip unit; drive means for moving the head toward and away from a member to be soldered and for increasing the force of the tip unit on the member to be soldered; means for enabling the drive means to move the tip unit to engage the member and to energize the heater for a predetermined period of time; and means for enabling said drive means to increase for a lesser period of time, during said predetermined period of time, the force between the tip unit and member. |
