PACKAGED MICROCIRCUIT AND METHOD FOR ASSEMBLY THEREOF

摘要

A packaged microcircuit includes a housing of insulating material having a plurality of apertures which extend from the interior of the housing to the outside. A metallized lead connection surface is formed on a wall of each aperture. A microcircuit having a plurality of terminals is disposed in the interior of the housing with each of its terminals aligned with a respective aperture. The individual leads extend into the apertures and are soldered to both the terminals and the housing. The first solder connection electrically connects each lead to the terminal aligned with the aperture and the second solder connection anchors each lead to the metallized surface of the housing to absorb mechanical stress applied to an outwardly extending portion of the lead.