| 摘要 |
PURPOSE:To reduce a distortion quantity given to an element by a sealing resin by a method wherein silicate such as enstatite having a chain-like bonding constitution or a two dimensional mesh constitution is dispersed into a base resin such as a hardened resin, etc. as a filler agent. CONSTITUTION:A curable resin such as a phenol.novolak type epoxy plastic is used as a base resin. As for this resin, a resin wherein a Barcol hardness reaches at least 80% or more by hardening is optimum. As for filler, a silicate having a chain- like bonding constitution such as enstatite (MgSiO3), wollastonite (CaSiO3), rhodomite, a silicate having a two dimensional mesh constitution such as kaolinite or steatite are used. With this, a distortion quantity given to an element such as a bipolar IC by a sealing resin can be reduced, thus, preventing the characteristics of an element from variation. |
