发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To obtain a stable sputter film easily, by providing a gate valve which cuts off the space in the target electrode plate side and the space in the electrode plate side mounting member to be sputtered from each other in the airtight state. CONSTITUTION:In the sputtering device which has target electrode plate 9 and electrode plate 4 mounting member to be sputtered in the airtight space part and applies a high-frequency voltage and a DC voltage across electrodes, gate valve 18 is provided between the aperture part of bell jar 1 and target 9. This gate valve 18 cuts off the space in the target 9 side and the space in the electrode plate 4 side from each other in the airtight condition. For exchange of substrate 5 to be stuck, gate valve 18 is closed, and bell jar 2 is opened. Consequently, target 9 in the space constituted by bell jar 1 and gate valve 18 is held in the same atmosphere as that for sputtering and is not polluted by adsorbe gas and so on. After exchange of substrate 5 to be stuck, bell jar 2 is made vacuum to generate the sputtering atmosphere, and gate valve 18 is opened, and sputtering is performed again.
申请公布号 JPS5665981(A) 申请公布日期 1981.06.04
申请号 JP19790141345 申请日期 1979.11.02
申请人 HITACHI LTD 发明人 KUMOUCHI TAKAAKI;ICHIKAWA MITSUO;NOBUTOKI SABUROU
分类号 H01J37/32;C23C14/34;C23C14/40;C23C14/56;H01J37/34 主分类号 H01J37/32
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