Epoxy resin compositions for sealing semiconductors

摘要

In an epoxy resin composition for sealing a semiconductor element containing about 50 to 85% by weight of an inorganic filler, the improvement wherein the inorganic filler comprises at least a silica powder and a calcium silicate powder, and the amount of said calcium silicate powder is about 20 to 75% by weight and the amount of the silica powder is about 25 to 80% by weight based on the total weight of the silica powder and calcium silicate powder.