| 摘要 |
An acidic electroplating bath containing, as a surfactant, a compound of the formula: R-Ar-O-(C3H6O)n-(C2H4O)m-H wherein R is at least one halide, aldehyde, amine, carboxyl, ketone or mixture thereof, Ar is benzene or naphthalene, n is from zero to 10, m is from zero to 100, and m+n is greater than zero.
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