| 摘要 |
PURPOSE:To provide the thermosensitive head which ensures accurate prevention of migration between conductors and higher density along with an excellent humidity resistant protection by coating a wiring block with the first and second thick film insulators. CONSTITUTION:Initially, a semiconductor block 4 comprising a semiconductor 16 and a cap 19 for sealing thereof is formed on a ceramic substrate 1. Then, separated at a desired distance, a sinterable first conductor 5 and a thick film insulator 6 and a sinterable second conductor 7 and the second thick film insulator 8 are provided in the that order to form a wiring block 2. A resistance block section 3 comprising a resistor 11 and a thin film insulator 13 is formed between these blocks 2 and 4 to connect the semiconductor 16 and the wiring block 2 by way of the first conductor 5 and the third conductor 12. In this manner, a thermosensitive head is obtained. The first and second conductors 5 and 7 are covered with the second insulators 6 and 8 of a thick film thereby improving the humidity resistant protection. |
