发明名称 VMOS Memory cell and method for making same
摘要 A semiconductor memory device is provided comprised of an integrated array of cells formed on a substrate in conjunction with parallel spaced-apart bit lines and conductive word lines that are perpendicular to the bit lines. A plurality of V-shaped recesses are located between and extend perpendicular to adjacent parallel bit lines. Two cells share each recess and each cell includes a VMOS transistor formed by one end portion of the recess and an isolated buried source region located under the adjacent bit line. A channel stop region is located between and isolates the VMOS transistors and their respective buried source regions at opposite ends of each recess. Thus, the VMOS pass gate is shared between adjacent bit lines and bit line capacitance is minimized. Also, the VMOS pass gates are self-aligned to eliminate alignment tolerances and minimize bit line capacitance. The invention also includes an efficient method for producing a semiconductor memory device with such an array of cells.
申请公布号 US4271418(A) 申请公布日期 1981.06.02
申请号 US19790089612 申请日期 1979.10.29
申请人 AMERICAN MICROSYSTEMS, INC. 发明人 HILTPOLD, WILLIAM R.
分类号 H01L27/108;H01L29/06;H01L29/423;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L27/108
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