发明名称 Peelable adhesive structure and method for its manufacture
摘要 A peelable adhesive structure comprises a plurality of articles, including at least one metal article, bonded together through a composite coating layer. The composite coating layer comprises adjacent first and second coating layers, the first coating layer containing vinyl resin, and the second coating layer containing epoxy resin. At least one of the coating layers comprises: (a) a peeling imparter at a concentration of between about 50 and 200 parts by weight per 100 parts of resin, and (b) a substantially linear saturated polyester wetting improver at a concentration of between about 2 and 50 parts per 100 parts of resin and having a molecular weight of between about 5,000 and about 50,000. Alternatively, at least one of the coating layers comprises a hydrocarbon or natural resin having a softening point less than 180 DEG C. and having a concentration between about 50 and 200 parts per 100 parts of resin. The vinyl resin or the epoxy resin is in the form of a continuous phase, and the hydrocarbon or natural resin is in the form of a dispersed phase. The adhesive structure has a peel strength of from 0.05 to about 5 kg/cm between the first and the second coating layers.
申请公布号 US4270665(A) 申请公布日期 1981.06.02
申请号 US19790050864 申请日期 1979.06.22
申请人 TOYO SEIKAN KAISHA, LTD. 发明人 KUNIMOTO, GO;MORI, FUMIO
分类号 B65D17/50;B65D41/12;B65D65/40;B65D77/20;(IPC1-7):B65D41/12;B32B15/08 主分类号 B65D17/50
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