| 摘要 |
PURPOSE:To remove the occurrence of burr in a recess boundary of a semiconductor device by forming a projection on the recess boundary between upper and lower dies, interposing under pressure a lead frame therebetween, press-fitting the projection to the frame and pouring molten material into the dies. CONSTITUTION:When the ends of the projections 13a, 13b of the upper and lower dies 10 and 11, respectively are faced and the lead frame 1 is interposed therebetween, the entire projection is press-fitted into the frame 1. Synthetic resin introduced under pressure to the recesses 5a and 5b in this state is not leaked out of a resin molding region. Thus, the boundary between the region and the external lead wire becomes distinct, and the step of plating the lead wire can be efficiently conducted. |
