| 摘要 |
PURPOSE:To mold an insert by covering the entire surface of the metal terminal body beforehand with a solder having softer property than the body, maintaining the mold temperature lower than 175+ or -5 deg.C, press-fitting synthetic resin into a cavity, thereby preventing a burr. CONSTITUTION:The comblike part except the connecting part of a terminal element 7 is covered with a solder film having softer property than the body, a semiconductor is connected to the insert side, and is sealed with a resin layer 21. Subsequently, it is set in the cavity 6 of the mold 10, the exposed part of the terminal 7 is disposed in a groove 8, and is temporarily positioned with a pin 9 and a hole 19. When the molds are tightened, the exposed part of the terminal 7 will slide on the oblique surface 22 of the groove 8 by a presser 24 due to the oblique surface 23 of the mold 18 to be retained at desired position. Thus, the insert is correctly set in the cavity 6. When the mold temperature is maintained lower than 175+ or -5 deg.C and the resin is press-fitted into the mold, the solder layer is softened and is thus filled in the facing surfaces of the mold to be sealed therein. Accordingly, no burr is produced in the molding. If the molding temperature is high, the solder is flowed out to cause a burr. According to this configuration the assembling work for a complete product can be easily conducted. |
