RESIN SEALING MOLDING METHOD OF SEMICONDUCTOR DEVICE,申请号JP19790139614-传众专利搜索

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发明名称	RESIN SEALING MOLDING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPS5663415(A)	申请公布日期	1981.05.30
申请号	JP19790139614	申请日期	1979.10.29
申请人	MITSUBISHI ELECTRIC CORP	发明人	TAKEMURA SEIJI
分类号	B29C33/00;B29B7/00;B29B13/00;B29C39/00;B29C39/10;B29C39/38;B29C39/42;H01L21/56	主分类号	B29C33/00
代理机构		代理人
主权项
地址

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