| 摘要 |
PURPOSE:To perform surface treatment so as to impart remarkable rust-preventive effect, and in particular to make good soldering possible, by allowing the surface of copper or copper alloy to contact with a soln. contg. an imidazole compound, then with a soln. contg. a COOH group successively. CONSTITUTION:Copper or copper alloy, the surface of which is finished clean by mechanical grinding etc., is immersed in a treating soln. contg. an imidazole compound shown by formula e.g. 2-methylimidazole. After the treating soln. on the metal surface is drained satisfactorily, if necessary after washed with water, the metal is immersed in a soln. of a compound contg. COOH group e.g. benzoic acid. The metal is pulled up and its surface is washed with water, then it is dried. As a result, tough chemically converted film is formed on the surface of copper or copper alloy, hereby remarkable rust-preventive property is imparted to said metal for a long time. In soldering, in addition, solder is melt sticked directly to said metal using no flux. |
