| 摘要 |
PURPOSE:To prevent the deterioration of airtightness and sealing intensity by constituting a cap by a main body having a gas releasing aperture and a cover adapted to be attached to the main body so as to close the aperture. CONSTITUTION:A semiconductor chip 1 is united to a base 10 and the main body 14 of a cap is placed on he base 10 to deposit the mainframe by glass 5 after connecting the semiconductor chip 1 to a lead frame. At that time, resin 1a on the chip is heated to emit a large quantity of gas which is diffused to the outside through an aperture 16. Therefore, gas pressure will not be generated in the space 6 and the dimension of a glass layer having sealing width l1, will not be reduced. Therefore, airtightness and sealing intensity will be improved. Then, a cover 15 is brazed 17 on the upper surface of the mainframe and a degassing hole 16 is airtightly sealed. Glazing temperature at that time is for below than the temperature at glass deposition. Therefore, gas emission from the resin on the chip 1 is a very small amount and gas pressure will not exist in the space 6 and the sealing function by the cover 15 will not be lost. In this composition, a high-reliability device housing a resin coated chip in a container will be obtained at low cost. |
