| 摘要 |
PURPOSE:To completely adhere a wafer to a cooling plate by providing each free end of a guide arm installed on a holding base plate and a holding arm with claws having tapers in one direction wherein the claw of the guide arm is attached to the fringe of a wafer. CONSTITUTION:A wafer 20 in a carrier is thrust by a lifter and a rise of the wafer is detected by adhering the upper fringe of the wafer to the claw of a guide arm 36 and a holding arm 37 starts its operation. The wafer is sent in a Y direction along tapers 38a located at one side of the claws 38 provided on free ends of arms 36, 37 at the same time of wafer rise. And the wafer is completely adhered to the steel plate 32A of a cooling plate 32 through a sheet 39. A cooling medium is flowed into the cooling plate 32 through paths 33. In this way, the wafer 20 is adhered to the cooling plate 32 and the generation of heat at the time of ion implantation by a large current is effectively cooled and the damage to the wafer will remarkably be reduced. |
