| 摘要 |
PURPOSE:To simplify the package of a completed device by making an alignment formation section around a metallic layer in a container wherein a positioning mark is provided on a semiconductor element surface and the element is exactly housed in the container. CONSTITUTION:Notches are provided around a metallic layer 20 provided in a container 1 and a plurality of alignment formation sections are provided. A positioning mark 23 corresponding to the alignment formation Section 21 is provided on an LED22 surface. The position is exactly aligned and the LED is housed in the metallic layer 20. Comb tooth 25 having equal pitches are made at the external circumference of a metallic layer 24 and alignment formation Sections 26 are made by extruding tooth at plural places. Positioning marks 28 corresponding to the alignment formation Sections 26 are provided on the surface of a photo diode 27 and the position is exactly aligned to house the photo diode 27 in the metallic layer 24. In this composition, fine position adjustment is unnecessary when a semiconductor element is packed in an apparatus after housing a semiconductor element in a container, and installation work will be simplified. |
