| 摘要 |
PURPOSE:To easily perform the alignment of the bonding pad section and the autoprober and to enable to shortening of the testing time of the element for the subject device by a method wherein a target pattern is provided on a silicon wafer. CONSTITUTION:An aluminum thin layer 15 is coated on the surface 10' of a silicon wafer 10 in such a shape as the 14 in the illustration using a selective plating method. When a laser beam is scanned on the silicon wafer 10 by providing the target 14, the laser beam is scanned on the surface 21 of the aluminum thin layer and the beam is not scattered on the surface 20 where the silicon wafer is exposed. As a reflected beam having a stabilized contrast is obtained, the alignment for a autoprober is performed by observing the reflected beam. A conductive material such as polycrystalline silicon or the like may be used as a material for the target 14 besides aluminum. |
