发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable mounting of the semiconductor device on an AC generator for a vehicle which vibrates extremely by sealing a semiconductor element and electrode lead wires connected to the element with a protecting material and reinforcing the surface of the material with an enclosure and sealing material. CONSTITUTION:An electrode plate 3 and lead wires 2 are connected to the semiconductor element and a conductive plate 4 used also as a heat dissipating plate is connected to the electrode plate 3. After the semiconductor element and the lead wires 2 are sealed with the protecting material 7, a ring-shaped sealing material 8' made of thermocurable adhesive and the enclosure 5 are sequentially engaged with the lead wires 2. An assembly thus associated is plated upside down, and is heated to melt the sealing material 8. Thus, a suitable amount of the sealing material 8 is immersed into the through hole 6 of the enclosure 5. The assembly is again placed upside down at this time, and the enclosure 5 is pressurized. Thus, the connecting part is rigidly maintained with excellent vibration-proof, electric, heat insulating and airtight properties.
申请公布号 JPS5660039(A) 申请公布日期 1981.05.23
申请号 JP19800143955 申请日期 1980.10.15
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 OGAWA KAZUO;SAWANO TAKAHIRO;SUZUKI KAZUYA;KAMIO KENJI
分类号 H01L23/48;H01L23/049;H01L23/28 主分类号 H01L23/48
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