发明名称 PREPARATION OF HEAT INSULATION BOARD
摘要 PURPOSE:To prepare the heat insulation boad without inhibiting the function of a connecting apparatus by a method wherein a foaming jig is arranged between both inner and other plates mounting a connecting apparatus therein and a foaming stock liquid is poured to be foamed and solidified as well as a gas between both plates is exhausted through a gas passing pore. CONSTITUTION:A periphery and an outer surface of both inner and outer plates 4, 5 arranged in a condition leaving a space therebetween are covered by the foaming jig 20 mounting a frame body, a base plate 24 and a press plate 25 and, if a stock liquid of a heat insulation material 6 is poured from a pouring port 22, the heat insulation material is foamed and expanded gradually. In this time, air between both inner and outer plates 4, 5 and a gas generated from the heat insulation material 6 are pressed as the heat insulation board is expanded and flowed to a direction of a gas passing part 18 and exhausted externally from a pierced pore 23 through a gas permeable member 19, the gas passing port 18 and a key chamber 13. As air and a gas exhaustion is completed, the heat insulation material 6 is solidified while the gas permeable member is extruded into a cylindrical portion by a foaming pressure in such a condition that a part of said heat insulation material 6 is impregnated in said gas permeable member 19 and the heat insulation board 2 is obtained.
申请公布号 JPS5658837(A) 申请公布日期 1981.05.22
申请号 JP19790134783 申请日期 1979.10.18
申请人 SANYO ELECTRIC CO;TOKYO SANYO ELECTRIC CO 发明人 OKAMOTO SHIGEMI
分类号 F25D23/06;B29B7/00;B29C39/00;B29C39/10;B29C39/18;B29C39/26;B29K105/04;B29L31/18;B32B5/18;F25D23/08 主分类号 F25D23/06
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