| 摘要 |
PURPOSE:To sufficiently cut outside air off any soldered section when electrode members holding a semiconductor pellet therebetween is soldered on each end of a pair of leads, by making the diameter of the header section of the heads larger than the diameter of an electrode member to ensure a glass sealing covering the soldered section. CONSTITUTION:Electrode members 3a and 3b made of W, Mo or the like firmly fixing an Si pellets therebetween are arranged with soldering materials 4a and 4b such as Al between a pair of leads with one end thereof formed like a nail head and soldered with the header section of the leads 11 and 11b employing soldering materials 2a and 2b mainly composed of Cu. Here, the diameter of the header section is made larger than the diameter of the electrode members 3a and 3b beforehand so that the electrode members 3a and 3b are sealed with a glass seal 6 including the soldered parts 2a and 2b. This keeps the soldering materials 2a and 2b off outside air thereby improving the corrosion resistance of the device significantly. |
