| 摘要 |
PURPOSE:To improve the sealing workability by a method wherein at least a resin case is disassembled in more than two pieces in advance, the case is fixed after a semiconductor device is set to inject a filler. CONSTITUTION:Two half divided cases 26, 27 having the same size soldering grooves as leads 22, 23 of the device 21 intended to be sealed are prepared. Leads 22, 23 are set in grooves 24, 25 of the case, and the case 27 is laid thereupon, the contact phase 28 is fixed by an ultrasonic deposition. Then, the specific filler 28 is injected to harden. According to said constitution, because the device can be set on the case without a gap toward outside, a filler of low viscosity can be employed without a fear of leakage. |
