| 摘要 |
Photoresist compositions with improved adhesion properties are provided for use in making printed circuit boards, lithographic plates, relief image plates or cylinders and for other applications in the graphic arts. The subject invention also provides for methods and photoresist elements utilizing the photoresist compositions. The photoresist compositions include, in addition to a photopolymerizable compound, a photo initiator, a polymeric binder, and other optional additives and N-substituted benzotriazoles which serve as improved adhesion promoters.
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