| 摘要 |
PURPOSE:To avoid the sticking of a brazing material to a wire bonded to an electroconductive plate by a method wherein the edge of the back corner part of the electroconductive plate is cut and the edge part is formed to be obtuse or arc-shaped when a lead formed of the electroconductive plate is brazed to a stem plate through the intermediary of an insulation plate. CONSTITUTION:Two insulation plates 1 formed of ceramic are fixed on to the stem plate 5 at a prescribed interval, and the leads 8 of electroconductive plates are brazed to the plates 1, while being extended outside, by using the brazing material 2 of Ag. Next, the part on the collector side of an Si pellet 9 is fixed on the substrate between the insulation plates 1 opposed to each other and a base and an emitter electrode provided on the part are bonded to the lead 8, by using a wire 4, thus to form a transistor. In this constitution, at the edge part on the side of the lead 8 contacting with the insulation plate 1 is provided the obtuse or arc-shaped corner part by cutting, and the brazing material 2 is fitted to this side. By this method, the sticking of the brazing material 2 to the front surface of the lead 8 is avoided and thereby the inferior bonding is prevented. |
