| 摘要 |
PURPOSE:To readily supply and position lead frames at the time of assembling them by forming uneven portion at the position corresponding to the front and back surfaces around a mounting portion of the frame of a semiconductor element, thereby preventing occurrence of warping. CONSTITUTION:Raised portions 11A and 11B are formed so as to surround a semiconductor element 3 in space at predetermined size form the mounting position of the element 3 at the center of the lead frame 4, and recessed portions 12A and 12B are correspondingly formed on the back surface to the portions 11A and 11B, respectively. This uneven portion can reduce the elongation of the lead frame in longitudinal direction. Since large raised portion of lateral and longitudinal sizes can be thus formed, the distance from the exterior to the element 3 can be increased after sealing resin. Thus, the moisture resistance can also be effectively improved. Since no slack is produced even if connecting the heat dissipating plates 81, 82... the lead frame can be readily supplied at the time of assembling them and the improvement of the accuracy of positioning the frame can be contrived. |
