| 摘要 |
PURPOSE:To accurately position on the entire surface of a large-diameter wafer by imparting an elongation or a contraction in opposite direction to the relative elongation or contraction occurred due to certain cause between the mask and the wafer to the mask and the wafer, thereby eliminating the size difference between the mask and the wafer. CONSTITUTION:When a mask 1 having a thickness t is slackened in an infinitesimal amount delta indicated by a broken line, there occurs a size variation of 4deltat/l between the surface 2 of the mask and the surface 3 of the mask when slackened as the length of the surface of the mask is represented by l. The mask 4 is adsorbed to a mask stage 5, a wafer 6 is adsorbed to a wafer stage 7, and positioning is conducted in this state. Subsequently, the stage 8 is raised, and the wafer 6 is urged onto the mask 4 by a spring 9. When the space between the mask 4 and the wafer 6 is evacuated to a vacuum and the adsorption to the wafer stage is eliminated so that both are brought into contact with each other, the size of the wafer 6 is varied. Then, the stage 8 is elevationally slacked variably, and positioning is conducted accurately on the entire surface. |
