发明名称 METHOD OF ADJUSTING MOLD TEMPERATURE AND DEVICE THEREOF
摘要 PURPOSE:To mintain a mold in a proper temperature at all times and to improve a working efficiency by shortening a molding cycle, by a method wherein two molding temperatures are detected, a valve is switched over according to the temperature at each mold, and either a heating medium or a cooling medium is fed to the mold according to the condition. CONSTITUTION:With a pump 6 actuated after a heater 5 is electrified for heating and cooling water is fed to a cooler 8, liquid in a liquid bath 7 is heated when it passes through a heater 5 through a circulating pipe 3, and it further passes through a liquid flow hole 2 in a mold 1 through a valve 4 for heating a mold 1. It returns to a liquid bath 7 after passing through a valve 10, a solenoid operated valve 9, and a side path pipe 11, and cycles again for heating the mold 1. The mold 1 heated to a given temperature is adhered closely to a mold 1' heated in a manner described above, and a molding materal molten by heating is poured into a gap formed thereupon for performing a molding process. When temperature of the mold 1 rises, an electric output is generated in a temperature detector 12, and electricity to a heater 5 is turned off, whereby the mold 1 is cooled.
申请公布号 JPS5655219(A) 申请公布日期 1981.05.15
申请号 JP19790131362 申请日期 1979.10.11
申请人 KANTO SEIKI CO 发明人 SUZUKI HIDEFUMI
分类号 B29B13/00;B29C33/00;B29C33/02;B29C33/04;B29C35/00 主分类号 B29B13/00
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