| 摘要 |
PURPOSE:To prevent the self decomposition of a positive active material by reducing the entire surface of a silver peroxide positive compound mold to a silver layer in specific quantity. CONSTITUTION:The entire peripheral surface of a mold 2 which is formed by press molding of a positive-compound the main component of which is silver peroxide is reducedto form a silver layer 8, when 30-50wt% of silver peroxide is reduced. To form a reduced silver layer, hydrazine, potassium sodium tartrate, or the like may be used as a reducing agent. The mold 2 with a silver layer 8 is included in a positive container 1 or may be remolded in it. The silver layer 8 may be formed on the entire surface of the mold 2 in one process or may be formed on the bottom and side surface in the first process, placed in a positive container 1, and then formed on the upper surface in the second process. Thus the self decomposition of this positive active material is less than that of conventional material which contains 10-30wt% of reduced silver layer at the surface, and the self life is improved. |
