发明名称 METHOD OF MANUFACTURING METALLIC PATTERN
摘要 A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side.
申请公布号 JPS5654093(A) 申请公布日期 1981.05.13
申请号 JP19800130025 申请日期 1980.09.18
申请人 HEWLETT PACKARD YOKOGAWA 发明人 ROORENSU II BURAUN;JIEEMUSU ERU BAUAA;JIERARUDO DABURIYU SHIETSUKU
分类号 B60S1/02;C23F1/02;G01B11/00;G01B11/03;G03F7/00;H05K1/16;H05K3/00;H05K3/06;H05K3/38 主分类号 B60S1/02
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