Wire bonding apparatus

摘要

An apparatus for bonding wires on semiconductors is provided with a processor controlled vertical drive mechanism coupled to a novel bonding head of the type having a bonding tool mounted therein. The height of the bonding tool at the reset position and at the bonding position may be programmed into the processor for different semiconductor devices or workpieces. Indicating means are provided on the novel bonding head for establishing the reset position and the bonding positions so that the bonding tool is taught a series of predetermined vertical positions during a bonding cycle. The apparatus is also programmed to compute intermediate positions between said predetermined vertical positions to obtain optimum high speed movement of the bonding head and the bonding tool during subsequent bonding cycles.