发明名称 Soldering procedure
摘要 <p>Soldering procedure in which at least the soldering surface of the workpiece is preheated to approx. the solder melting temp. by application and circulation of a pref. high-speed and turbulent gas flow.</p>
申请公布号 DE1807607(A1) 申请公布日期 1970.06.25
申请号 DE19681807607 申请日期 1968.11.07
申请人 PYRONICS INC. 发明人 EDMOND MILLER,HARRY;ARNOLD METZGER,BENJAMIN
分类号 B23K1/012 主分类号 B23K1/012
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