| 摘要 |
PURPOSE:To improve cooling effect by forming a refrigerant passage with a wall which is pierced by signal pins provided on the reverse side of a package and making these signal pins function as cooling fins. CONSTITUTION:The ICs 2 are formed on the package 1, and the signal pins 4 are attached onto the reverse side. By providing the wall 6 which is pierced by the signal pins 4, the refrigerant 7 is made to flow from an inlet 8 to a flow passage 7 and discharged from an outlet 9 to cool the pins 4. The wall is to be made of an insulating material or provided with an insulating seal. It is possible, by doing so, to improve IC mounting density and cooling effect. |
