| 摘要 |
PURPOSE:To permit the mounting area on a printed board as well as the inner wiring to be reduced by providing inner pads for connection on the circumference of the cavity in an outer frame and a large number of latticed leadless outer pads on the bottom of the package on the opposite side from the inner pads. CONSTITUTION:A LSI is secured to a bottom 4 of the cavity in a ceramic outer frame 8. A step 5 is made on the circumference of the cavity, and inner pads 6 for connection are arranged on flat portions 8 at proper pitches. A step 7 forms an insulating space needed for connection. On the upper surface of the outer frame 8, a ceramic cap 3 is placed and sealed. Leadless outer pads 9 are formed on the lower surface of the cap 3 into lattice points having pitches 10 and 11. Inner wiring of the outer pads 9 with the inner pads 6 is performed by the well-known method: laminating a large number of ceramic substrates. The constitution permits multipin terminals to be rationally arranged as well as inner and outer terminals to be connected by themselves. Thus, a highly practical effect can be expected. |
