| 摘要 |
<p>PURPOSE:To obtain a compact semiconductor device provided with an insulating plate between its semiconductor element and heat sink by reducing the number of mounting processes to only one and simplifying the attachment of the internal leads and the external terminals. CONSTITUTION:On a heat sink 13; solder 14, an insulating plate 15, solder 16 and an anode terminal 11 are mounted. Moreover, solder 2 and a pellet 3 are mounted on this, and a cathode and gate lead wires 6 and 7 are soldered 4 and 5. Then, an E case 20 having an injection port A is attached to the heat sink 13, and pipes 24 and 25 each having a terminal are attached to the leads 6 and 7 and pinch-welded respectively. The pipes 24 and 25 are secured to the E case 20 by using stoppers 26 and 27, and resin is injected from the port A to mold. The constitution permits the number of the manufacturing processes to be reduced, the external terminals to be readily attached, and a compact device to be obtained.</p> |
