发明名称 COVERING RESIN COMPOSITION
摘要 PURPOSE:To provide the titled composition having excellent adhesive property, resistance to boiling water, mechanical strength, hardness, and solvent resistance and consisting of a modified ethylene/vinyl acetate copolymer, a low polymer prepared from maleic anhydride and a styrene, and an epoxy resin. CONSTITUTION:100pts.wt. of (A) a modified ethylene/vinyl acetate copolymer prepared by grafting an unsaturated carboxylic acid onto a hydrolyzed product of an ethylene/vinyl acetate/(unsaturated carboxylic acid)copolymer containing 3- 40mol% of vinyl acetate is compound with 1-40pts.wt. of (B) a low polymer prepared from maleic anhydride and a styrenic monomer of the formula (R1: H, 1-4C alkyl; X1 and X2: each H, alkyl, cycloakyl, aryl, aralkyl, and halogen), and 5-20pts.wt. of (C) an epoxy resin of m.p. 50-130 deg.C, mean MW 800-4,000, epoxy equivalent 400-3,000 and having two or more epoxy goup per molecule.
申请公布号 JPS5650941(A) 申请公布日期 1981.05.08
申请号 JP19790127753 申请日期 1979.10.02
申请人 SUMITOMO CHEMICAL CO 发明人 KONDOU TOMIZOU;TAKAHIRA AKITOSHI;HORIUCHI HIROSHI;TAKENAKA TOSHIO
分类号 C08L23/00;B32B15/08;B32B15/092;C08G59/00;C08L23/08;C08L23/26;C08L25/08;C08L29/04;C08L31/04;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L51/06;C08L63/00;C08L101/00;C09D5/03;C09D129/04 主分类号 C08L23/00
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