| 摘要 |
PURPOSE:To improve the soldering characteristics by constituting the lead part of the semiconductor device by the alloy comprising copper, nickel, and iron and giving adequate thermal expanding characteristics with respect to the packaging material. CONSTITUTION:The alloy comprising 1-25wt% of copper, 25-50wt% of nickel, and iron for the rest of the alloy is used for the lead parts, e.g. a lead frame and lead wires, of the semiconductor device. The thermal expansion coefficient of said alloy can be freely changed from the very low value by changing the ratio of its constituents. The properties such as strength, repeated bending, and the like are excellent, and the soldering characteristics are especially excellent in comparison with conventional iron-and-nickel alloys. Semiconductor devices such as diodes, transistors, and integrated circuits are considered for this applications. It is especially useful in the case the packaging is performed with the lead portions directly contacted with a glass material. |
