发明名称 Automatic adjusting method for two structures in parallel planes - using sensors and markings on opposite planes to detect correspondence
摘要 <p>The automatic adjusting process is esp. suitable for the prodn. of integrated semiconductor circuits using lithographic processing stages. Mask (3) structures are transmitted to a radiation-sensitive, doped layer of a semiconductor crystal wafer (1). Complementary markings (4,6) are used for the adjusting in both planes. Sensors (6) are integrated in or on one of the planes so that, by a corresp. marking in the opposite plane, a correspondence between the relative position of the planes and the sensor signals is formed. The sensors can be produced by thin film technology. Electrical contacts can be brought to the mask edge by conductive paths. From here the measuring signal is conducted to measuring electronic circuitry. Differential photo diodes can be used as the sensors, the adjusting being carried out by light adding and difference measurements.</p>
申请公布号 DE2942990(A1) 申请公布日期 1981.05.07
申请号 DE19792942990 申请日期 1979.10.24
申请人 SIEMENS AG 发明人 TREML,HANS;WEBER,KARL,DR.
分类号 G03F9/00;H01L21/67;(IPC1-7):01L21/68;01L21/31 主分类号 G03F9/00
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