| 摘要 |
PURPOSE:To form the package which has excellent water rejeting property, water permeability, and a high crack withstanding property; by using an epoxy molding material wherein fluorine resin is blended, as a resinous material for mold-sealing a semiconductor chip. CONSTITUTION:The semiconductor chip 2 is die-bonded on a tub 3 of a lead frame 1, wire bonded to leads 4 of the lead frame 1, and mold-sealed with a resinous material 5 by a transfer molding method; thereby a DIP type semiconductor device is formed. Said resinous material 5 is prepared by blending 5-80vol% of particles of fluorine resin whose diameter is 0.5-100mum, such as tetrafluoroethylene resin, tetrafluoroethylene-ethylene copolymerization resin, tetrafluoroethylene-propylene hexafluoride copolymerization resin, and the like into an epoxy molding material before thermal melting. The molding is performed by the coventional transfer molding method. |
