| 摘要 |
PURPOSE:To improve resins in adhesive property by attaching carbon-functional silane to the surface of the tub or a lead frame of a pellet upon resin molding after fitting the pellet on the surface of the tub. CONSTITUTION:A semiconductor pellet 3 is fastened to the upper surface of a tub provided at the central part of a lead frame 1 and thus-obtained electrode is connected to the lead 4 of the frame 1 using a wire 5. Next, the pellet 3 is turned upside down and one or several drips of carbon-functional silane 6 let fall onto the reverse side of the tub 2. Thereafter, the frame 1 and pellet 3 are supported in a chamber 9 consisting of upper and lower dies 7 and 8 and a resin 10 is molded through pressure-supply for completing a package. Silane 6 is superior in the affinity with the resin 10 and liable to combining with O2 of the oxide layer on the surface of the lead 4 or SiO2 on the surface of the pellet 3 so that the resin 10 improves in adhesive property. |
