| 发明名称 |
All metal flat package having excellent heat transfer characteristics |
| 摘要 |
An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.
|
| 申请公布号 |
US4266089(A) |
申请公布日期 |
1981.05.05 |
| 申请号 |
US19780942329 |
申请日期 |
1978.09.14 |
| 申请人 |
ISOTRONICS, INCORPORATED |
发明人 |
SCHERER, JEREMY D. |
| 分类号 |
H01L21/50;H01L23/047;(IPC1-7):H05K5/04 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
