| 摘要 |
PURPOSE:To release stress occurring in connecting parts and make the dimensions and shape of a frame stable, when supporting the opposing two sides of a semiconductor element mounting tab formed in a lead frame with connecting pieces, by providing bent parts for these connecting pieces. CONSTITUTION:In the center of a lead frame, a semiconductor element mounting tab 2113 is made, it is supported with connecting pieces 2112 which are formed integrally with both ends of the fame, and to the tab 2113, plural lead pieces 2111 projected from both ends of the frame at intervals are faced. In this construction, the connecting pieces 2112 connected with the opposing two sides of the tab 2113 are not formed in the same plane as the tab 2113, but bent parts 2112a are provided in their connecting portions. By so doing, generation of tensile stress can be prevented without preparing a special stress absorbing part and the deformation of the frame can be avoided easily. |
